Granted Patent
Utility
US 6,649,999 · App. 10/187,766
Semiconductor chip configuration with a layer sequence with functional elements contacted by contact pads
Inventor:
Gerd Frankowsky
Patented Case
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Granted: Nov 18, 2003
Filed: Jul 2, 2002
Inventor
Gerd Frankowsky
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.