Granted Patent
Utility
US 6,653,210 · App. 10/150,971
Method and apparatus for cutting a non-metallic substrate using a laser beam
Inventors:
Dae-Ho Choo, Baek-Kyun Jeon, Hyung-Woo Nam
Patented Case
View Patent ↗
Granted: Nov 25, 2003
Filed: May 21, 2002
Inventors
Dae-Ho Choo
Baek-Kyun Jeon
Hyung-Woo Nam
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.