Granted Patent
Utility
US 6,653,218 · App. 10/287,532
Method of fabricating resin-encapsulated semiconductor device
Inventors:
Shinji Ohuchi, Harufumi Kobayashi, Yasushi Shiraishi
Patented Case
View Patent ↗
Granted: Nov 25, 2003
Filed: Nov 5, 2002
Inventors
Shinji Ohuchi
Harufumi Kobayashi
Yasushi Shiraishi
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.