Granted Patent
Utility
US 6,653,723 · App. 10/094,954
System for providing an open-cavity low profile encapsulated semiconductor package
Inventor:
Michael Manansala
Patented Case
View Patent ↗
Granted: Nov 25, 2003
Filed: Mar 9, 2002
Inventor
Michael Manansala
Assignee (at issue)
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.