Granted Patent
Utility
US 6,653,727 · App. 10/293,532
Semiconductor chip package with direction-flexible mountability
Inventors:
Yi-Sung Hwang, Sang Woo Kim
Patented Case
View Patent ↗
Granted: Nov 25, 2003
Filed: Nov 12, 2002
Inventors
Yi-Sung Hwang
Sang Woo Kim
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.