IP Library › Granted Patent US 6,653,740
Granted Patent Utility
US 6,653,740 · App. 09/780,080

Vertical conduction flip-chip device with bump contacts on single surface

Inventors: Daniel M. Kinzer, Aram Arzumanyan, Tim Sammon
Patented Case View Patent ↗
Granted: Nov 25, 2003 Filed: Feb 9, 2001
Inventors
Daniel M. Kinzer
Aram Arzumanyan
Tim Sammon
Assignee (at issue)
International Rectifier Corporation

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Quick Facts
Patent No.
US 6,653,740
App. No.
09/780,080
Filed
2001-02-09
Granted
2003-11-25
Kind
B2