Granted Patent
Utility
US 6,656,526 · App. 09/956,432
Porously coated open-structure substrate and method of manufacture thereof
Inventor:
Alfred I-Tsung Pan
Patented Case
View Patent ↗
Granted: Dec 2, 2003
Filed: Sep 20, 2001
Inventor
Alfred I-Tsung Pan
Assignee (at issue)
Hewlett-Packard Development Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.