Granted Patent
Utility
US 6,656,762 · App. 10/166,618
Method for manufacturing semiconductor image sensor with color filters and bonding pads
Inventor:
Jaekap Kim
Patented Case
View Patent ↗
Granted: Dec 2, 2003
Filed: Jun 12, 2002
Inventor
Jaekap Kim
Assignee (at issue)
Dongbu Electronics, Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.