IP Library Granted Patent US 6,656,836
Granted Patent Utility
US 6,656,836 · App. 10/100,395

Method of performing a two stage anneal in the formation of an alloy interconnect

Inventors: Pin-Chin Connie Wang, Paul R. Besser
Patented Case View Patent ↗
Granted: Dec 2, 2003 Filed: Mar 18, 2002
Inventors
Pin-Chin Connie Wang
Paul R. Besser
Assignee (at issue)
Advanced Micro Devices, Inc.

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Quick Facts
Patent No.
US 6,656,836
App. No.
10/100,395
Filed
2002-03-18
Granted
2003-12-02
Kind
B1