IP Library Granted Patent US 6,656,841
Granted Patent Utility
US 6,656,841 · App. 10/315,126

Method of forming multi layer conductive line in semiconductor device

Inventor: Dong Joon Kim
Patented Case View Patent ↗
Granted: Dec 2, 2003 Filed: Dec 10, 2002
Inventor
Dong Joon Kim
Assignee (at issue)
SK hynix Inc.

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Quick Facts
Patent No.
US 6,656,841
App. No.
10/315,126
Filed
2002-12-10
Granted
2003-12-02
Kind
B1