IP Library › Granted Patent US 6,662,799
Granted Patent Utility
US 6,662,799 · App. 09/974,409

Vertical wafer sawing apparatus

Inventors: Dong-Kuk Kim, Seung-Chul Ahn
Patented Case View Patent ↗
Granted: Dec 16, 2003 Filed: Oct 9, 2001
Inventors
Dong-Kuk Kim
Seung-Chul Ahn
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.

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Quick Facts
Patent No.
US 6,662,799
App. No.
09/974,409
Filed
2001-10-09
Granted
2003-12-16
Kind
B2