Granted Patent
Utility
US 6,663,468 · App. 09/754,193
Method for polishing surface of semiconductor device substrate
Inventors:
Yoshio Kawamura, Kan Yasui, Masahiko Sato, Souichi Katagiri, Masayuki Nagasawa, Kunio Harada, Satoshi Osabe, Ui Yamaguchi
Patented Case
View Patent ↗
Granted: Dec 16, 2003
Filed: Jan 5, 2001
Inventors
Yoshio Kawamura
Kan Yasui
Masahiko Sato
Souichi Katagiri
Masayuki Nagasawa
Kunio Harada
Satoshi Osabe
Ui Yamaguchi
Assignee (at issue)
HITACHI, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.