Granted Patent
Utility
US 6,664,178 · App. 09/824,203
Method of forming buried interconnecting wire
Inventor:
Tokuhiko Tamaki
Patented Case
View Patent ↗
Granted: Dec 16, 2003
Filed: Apr 3, 2001
Inventor
Tokuhiko Tamaki
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.