Granted Patent
Utility
US 6,664,614 · App. 09/415,268
Lead frame and bottom lead semiconductor package using the lead frame
Inventor:
Sun-Dong Kim
Patented Case
View Patent ↗
Granted: Dec 16, 2003
Filed: Oct 12, 1999
Inventor
Sun-Dong Kim
Assignee (at issue)
Hyundai Microelectronics Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.