Granted Patent
Utility
US 6,667,547 · App. 10/243,568
High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
Inventors:
Arthur Woodworth, Peter R. Ewer, Ken Teasdale
Patented Case
View Patent ↗
Granted: Dec 23, 2003
Filed: Sep 13, 2002
Inventors
Arthur Woodworth
Peter R. Ewer
Ken Teasdale
Assignee (at issue)
International Rectifier Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.