Granted Patent
Utility
US 6,667,556 · App. 10/302,594
Flip chip adaptor package for bare die
Inventor:
Walter L. Moden
Patented Case
View Patent ↗
Granted: Dec 23, 2003
Filed: Nov 22, 2002
Inventor
Walter L. Moden
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.