Granted Patent
Utility
US 6,669,079 · App. 10/211,631
Conductive paste and semiconductor component having conductive bumps made from the conductive paste
Inventors:
Li Li, Treliant Fang
Patented Case
View Patent ↗
Granted: Dec 30, 2003
Filed: Aug 2, 2002
Inventors
Li Li
Treliant Fang
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.