Granted Patent
Utility
US 6,672,503 · App. 09/960,042
Method of bonding wires
Inventors:
Siu Wing Or, Honghai Zhu, Yam Mo Wong, Honyu Ng
Patented Case
View Patent ↗
Granted: Jan 6, 2004
Filed: Sep 21, 2001
Inventors
Siu Wing Or
Honghai Zhu
Yam Mo Wong
Honyu Ng
Assignee (at issue)
ASM TECHNOLOGY SINGAPORE PTE LTD
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.