Granted Patent
Utility
US 6,673,655 · App. 10/152,726
Method of making semiconductor device having improved heat radiation plate arrangement
Inventors:
Fujio Ito, Hiroaki Tanaka, Hiromichi Suzuki, Tokuji Toida, Takafumi Konno, Kunihiro Tsubosaki, Shigeki Tanaka, Kazunari Suzuki, Akihiko Kameoka
Patented Case
View Patent ↗
Granted: Jan 6, 2004
Filed: May 23, 2002
Inventors
Fujio Ito
Hiroaki Tanaka
Hiromichi Suzuki
Tokuji Toida
Takafumi Konno
Kunihiro Tsubosaki
Shigeki Tanaka
Kazunari Suzuki
Akihiko Kameoka
Assignees (at issue)
HITACHI, LTD.
Hitachi Ulsi Systems Co., Ltd.
Hitachi Hokkai Semiconductor Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.