Granted Patent
Utility
US 6,673,698 · App. 10/054,001
Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers
Inventors:
Mou-Shiung Lin, Jin-Yuan Lee, Ching-Cheng Huang
Patented Case
View Patent ↗
Granted: Jan 6, 2004
Filed: Jan 19, 2002
Inventors
Mou-Shiung Lin
Jin-Yuan Lee
Ching-Cheng Huang
Assignee (at issue)
Megica Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.