Granted Patent
Utility
US 6,676,496 · App. 09/835,359
Apparatus for processing semiconductor wafers
Inventors:
Kan Yasui, Shigeo Moriyama, Katsuhiko Yamaguchi, Yoshio Homma
Patented Case
View Patent ↗
Granted: Jan 13, 2004
Filed: Apr 17, 2001
Inventors
Kan Yasui
Shigeo Moriyama
Katsuhiko Yamaguchi
Yoshio Homma
Assignee (at issue)
HITACHI, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.