Granted Patent
Utility
US 6,676,885 · App. 09/781,789
Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding dies
Inventors:
Kazuo Shimizu, Hisayuki Tsuruta
Patented Case
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Granted: Jan 13, 2004
Filed: Feb 12, 2001
Inventors
Kazuo Shimizu
Hisayuki Tsuruta
Assignee (at issue)
NEC Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.