Granted Patent
Utility
US 6,681,483 · App. 10/125,221
Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices
Inventors:
E. James Crescenzi, Anwar Mohammed
Patented Case
View Patent ↗
Granted: Jan 27, 2004
Filed: Apr 18, 2002
Inventors
E. James Crescenzi
Anwar Mohammed
Assignee (at issue)
Remec, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.