Granted Patent
Utility
US 6,685,543 · App. 10/117,088
Compensating chemical mechanical wafer polishing apparatus and method
Inventors:
Jer-Shyong Lai, Wen-Chueh Pan, Yang-Jiann Fann, Yih-Hsing Wang, Chien-Cheng He, Chaug-Liang Hsu
Patented Case
View Patent ↗
Granted: Feb 3, 2004
Filed: Apr 8, 2002
Inventors
Jer-Shyong Lai
Wen-Chueh Pan
Yang-Jiann Fann
Yih-Hsing Wang
Chien-Cheng He
Chaug-Liang Hsu
Assignee (at issue)
CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.