Granted Patent
Utility
US 6,686,664 · App. 09/845,448
Structure to accommodate increase in volume expansion during solder reflow
Inventors:
David V. Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel
Patented Case
View Patent ↗
Granted: Feb 3, 2004
Filed: Apr 30, 2001
Inventors
David V. Caletka
Krishna Darbha
Donald W. Henderson
Lawrence P. Lehman
George H. Thiel
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.