Granted Patent
Utility
US 6,686,665 · App. 10/235,762
Solder pad structure for low temperature co-fired ceramic package and method for making the same
Inventors:
Guilian Gao, David J. Lewis, Stephen Thomas Murphy
Patented Case
View Patent ↗
Granted: Feb 3, 2004
Filed: Sep 4, 2002
Inventors
Guilian Gao
David J. Lewis
Stephen Thomas Murphy
Assignee (at issue)
Zeevo, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.