Granted Patent
Utility
US 6,693,034 · App. 10/229,868
Deadhesion method and mechanism for wafer processing
Inventors:
Guy T. Blalock, Hugh E. Stroupe, Brian F. Gordon
Patented Case
View Patent ↗
Granted: Feb 17, 2004
Filed: Aug 27, 2002
Inventors
Guy T. Blalock
Hugh E. Stroupe
Brian F. Gordon
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.