Granted Patent
Utility
US 6,696,665 · App. 09/954,410
Method for introducing plated-through holes into an electrically insulating base material having a metal layer on each side
Inventor:
Marcel Heerman
Patented Case
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Granted: Feb 24, 2004
Filed: Sep 17, 2001
Inventor
Marcel Heerman
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.