Granted Patent
Utility
US 6,696,747 · App. 09/687,585
Semiconductor package having reduced thickness
Inventors:
Tae Heon Lee, Mu Hwan Seo
Patented Case
View Patent ↗
Granted: Feb 24, 2004
Filed: Oct 13, 2000
Inventors
Tae Heon Lee
Mu Hwan Seo
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.