Granted Patent
Utility
US 6,697,260 · App. 10/040,421
High-speed package design with suspended substrates and PCB
Inventors:
Yu-Ju Chen, Thomas J. Sleboda, Michael Z. Wong, Hui-Hsien Wu
Patented Case
View Patent ↗
Granted: Feb 24, 2004
Filed: Oct 29, 2001
Inventors
Yu-Ju Chen
Thomas J. Sleboda
Michael Z. Wong
Hui-Hsien Wu
Assignee (at issue)
Big Bear Networks, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.