IP Library Granted Patent US 6,698,089
Granted Patent Utility
US 6,698,089 · App. 09/918,126

Device for bonding a wire conductor

Inventors: David Finn, Manfred Rietzler
Patented Case View Patent ↗
Granted: Mar 2, 2004 Filed: Jul 30, 2001
Inventors
David Finn
Manfred Rietzler

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Quick Facts
Patent No.
US 6,698,089
App. No.
09/918,126
Filed
2001-07-30
Granted
2004-03-02
Kind
B2