Granted Patent
Utility
US 6,698,486 · App. 10/008,703
Apparatus for removing wafer ring tape
Inventor:
Seok Goh
Patented Case
View Patent ↗
Granted: Mar 2, 2004
Filed: Dec 6, 2001
Inventor
Seok Goh
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.