Granted Patent
Utility
US 6,700,207 · App. 10/212,448
Flip-chip ball grid array package for electromigration testing
Inventors:
Senol Pekin, Anand Govind, Carl Iwashita
Patented Case
View Patent ↗
Granted: Mar 2, 2004
Filed: Aug 5, 2002
Inventors
Senol Pekin
Anand Govind
Carl Iwashita
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.