Granted Patent
Utility
US 6,702,176 · App. 10/011,808
Solder, method for processing surface of printed wiring board, and method for mounting electronic part
Inventors:
Toshihide Ito, Shiro Hara
Patented Case
View Patent ↗
Granted: Mar 9, 2004
Filed: Dec 11, 2001
Inventors
Toshihide Ito
Shiro Hara
Assignees (at issue)
NEC Toppan Circuit Solutions, Inc.
Soldercoat Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.