Granted Patent
Utility
US 6,703,299 · App. 10/032,115
Underfill process for flip-chip device
Inventors:
Song Shi, Milan Djukic
Patented Case
View Patent ↗
Granted: Mar 9, 2004
Filed: Dec 21, 2001
Inventors
Song Shi
Milan Djukic
Assignee (at issue)
Intel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.