Granted Patent
Utility
US 6,703,308 · App. 09/994,400
Method of inserting alloy elements to reduce copper diffusion and bulk diffusion
Inventors:
Paul R. Besser, Matthew S. Buynoski, Sergey Lopatin, Alline F. Myers, Phin-Chin Connie Wang
Patented Case
View Patent ↗
Granted: Mar 9, 2004
Filed: Nov 26, 2001
Inventors
Paul R. Besser
Matthew S. Buynoski
Sergey Lopatin
Alline F. Myers
Phin-Chin Connie Wang
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.