Granted Patent
Utility
US 6,705,124 · App. 09/874,434
High-density plasma deposition process for fabricating a top clad for planar lightwave circuit devices
Inventors:
Fan Zhong, Jonathan Bornstein
Patented Case
View Patent ↗
Granted: Mar 16, 2004
Filed: Jun 4, 2001
Inventors
Fan Zhong
Jonathan Bornstein
Assignee (at issue)
LIGHTWAVE MICROSYSTEMS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.