IP Library › Granted Patent US 6,706,563
Granted Patent Utility
US 6,706,563 · App. 10/119,920

Heat spreader interconnect methodology for thermally enhanced PBGA packages

Inventors: Il Kwon Shim, Hermes T. Apale, Gerry Balanon
Patented Case View Patent ↗
Granted: Mar 16, 2004 Filed: Apr 10, 2002
Inventors
Il Kwon Shim
Hermes T. Apale
Gerry Balanon
Assignee (at issue)
ST Assembly Test Services Pte Ltd

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Quick Facts
Patent No.
US 6,706,563
App. No.
10/119,920
Filed
2002-04-10
Granted
2004-03-16
Kind
B2