IP Library Granted Patent US 6,709,564
Granted Patent Utility
US 6,709,564 · App. 09/410,250

Integrated circuit plating using highly-complexed copper plating baths

Inventors: D. Morgan Tench, John T. White, Dieter Dornisch, Maureen R. Brongo
Patented Case View Patent ↗
Granted: Mar 23, 2004 Filed: Sep 30, 1999
Inventors
D. Morgan Tench
John T. White
Dieter Dornisch
Maureen R. Brongo
Assignee (at issue)
Rockwell Scientific Licensing LLC

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Quick Facts
Patent No.
US 6,709,564
App. No.
09/410,250
Filed
1999-09-30
Granted
2004-03-23
Kind
B1