Granted Patent
Utility
US 6,709,891 · App. 10/231,347
Open-cavity semiconductor die package
Inventors:
Sanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li
Patented Case
View Patent ↗
Granted: Mar 23, 2004
Filed: Aug 30, 2002
Inventors
Sanford W. Crane, Jr.
Lakshminarasimha Krishnapura
Yun Li
Assignee (at issue)
Silicon Bandwidth, Inc.,
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.