Granted Patent
Utility
US 6,709,898 · App. 09/679,733
Die-in-heat spreader microelectronic package
Inventors:
Qing Ma, Harry Fujimoto, Steven Towle, John E. Evert
Patented Case
View Patent ↗
Granted: Mar 23, 2004
Filed: Oct 4, 2000
Inventors
Qing Ma
Harry Fujimoto
Steven Towle
John E. Evert
Assignee (at issue)
Intel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.