Granted Patent
Utility
US 6,710,430 · App. 10/083,160
Resin-encapsulated semiconductor device and method for manufacturing the same
Inventors:
Masanori Minamio, Toru Nomura, Fumihiko Kawai
Patented Case
View Patent ↗
Granted: Mar 23, 2004
Filed: Feb 27, 2002
Inventors
Masanori Minamio
Toru Nomura
Fumihiko Kawai
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.