IP Library › Granted Patent US 6,710,434
Granted Patent Utility
US 6,710,434 · App. 10/261,833

Window-type semiconductor package and fabrication method thereof

Inventor: Jin-Chuan Bai
Patented Case View Patent ↗
Granted: Mar 23, 2004 Filed: Sep 30, 2002
Inventor
Jin-Chuan Bai
Assignee (at issue)
Ultratera Corporation

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Quick Facts
Patent No.
US 6,710,434
App. No.
10/261,833
Filed
2002-09-30
Granted
2004-03-23
Kind
B1