Granted Patent
Utility
US 6,710,461 · App. 10/162,905
Wafer level packaging of micro electromechanical device
Inventors:
Bruce C. S. Chou, Hsien-Ming Wu, Ping Sun
Patented Case
View Patent ↗
Granted: Mar 23, 2004
Filed: Jun 6, 2002
Inventors
Bruce C. S. Chou
Hsien-Ming Wu
Ping Sun
Assignee (at issue)
Lightuning Tech. Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.