Granted Patent
Utility
US 6,711,075 · App. 09/906,060
Semiconductor wafer, semiconductor chip, and manufacturing method of semiconductor device
Inventors:
Yoshikazu Saitoh, Sadayuki Morita, Takahiro Sonoda
Patented Case
View Patent ↗
Granted: Mar 23, 2004
Filed: Jul 17, 2001
Inventors
Yoshikazu Saitoh
Sadayuki Morita
Takahiro Sonoda
Assignees (at issue)
Renesas Technology Corporation
Hitachi Ulsi Systems Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.