Granted Patent
Utility
US 6,713,792 · App. 10/060,563
Integrated circuit heat sink device including through hole to facilitate communication
Inventor:
Leendert J. van der Windt
Patented Case
View Patent ↗
Granted: Mar 30, 2004
Filed: Jan 30, 2002
Inventor
Leendert J. van der Windt
Assignee (at issue)
Anaren Microwave, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.