Granted Patent
Utility
US 6,713,849 · App. 09/988,644
Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resin
Inventors:
Hajime Hasebe, Tadatoshi Danno, Yukihiro Satou
Patented Case
View Patent ↗
Granted: Mar 30, 2004
Filed: Nov 20, 2001
Inventors
Hajime Hasebe
Tadatoshi Danno
Yukihiro Satou
Assignees (at issue)
HITACHI, LTD.
Hitachi Hokkai Semiconductor Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.