Granted Patent
Utility
US 6,715,203 · App. 09/789,341
Substrate for power semiconductor modules with through-plating of solder and method for its production
Inventors:
Thilo Stolze, Manfred Loddenkoetter
Patented Case
View Patent ↗
Granted: Apr 6, 2004
Filed: Feb 20, 2001
Inventors
Thilo Stolze
Manfred Loddenkoetter
Assignee (at issue)
EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.