Granted Patent
Utility
US 6,716,669 · App. 10/284,999
High-density interconnection of temperature sensitive electronic devices
Inventors:
Kenneth R. Erikson, John Marciniec
Patented Case
View Patent ↗
Granted: Apr 6, 2004
Filed: Oct 31, 2002
Inventors
Kenneth R. Erikson
John Marciniec
Assignee (at issue)
BAE Systems Information and Electronic Systems Integration Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.