Granted Patent
Utility
US 6,716,720 · App. 10/378,244
Method for filling depressions on a semiconductor wafer
Inventors:
Dirk Efferenn, Hans-Peter Moll
Patented Case
View Patent ↗
Granted: Apr 6, 2004
Filed: Mar 3, 2003
Inventors
Dirk Efferenn
Hans-Peter Moll
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.